Abstract
Aluminum nitride (AIN) with high thermal conductivity has been considered as a potential substrate material for microelectronics. However, the thermal conductivity of polycrystalline AIN ceramics, prepared by liquid-phase sintering, is significantly lower than that of AIN single crystal. It has been shown that the thermal conductivity of AIN is inversely proportional to the oxygen content dissolved in the AIN lattice. Furthermore, the microstructure of AIN can also influence the thermal conductivity considerably. In the present study, we investigated the effect of grain boundaries and secondary phase distributions on thermal conductivity of two selected high density samples which contained similar oxygen content but showed different thermal conductivities.Experimental details and selected properties of Samples A and B are shown in Table 1. Sample A with 0.8 wt% Y2O3 additive was embedded in an AIN powder bed in a BN crucible covered by a BN lid (not gas tight) during sintering, while Sample B with 3.9 wt% Y2O3 was embedded in an AIN powder bed in an open graphite crucible.
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