Microstructure and residual stress gradient evolution mechanism of electronic copper strip for lead frame

Abstract

The miniaturization of integrated circuits has led to a shift in lead frame fabrication methods from physical stamping to chemical etching. However, this process is highly sensitive to residual stress. We investigated the gradient distribution of residual stress, microstructure, and macroscopic texture in electronic copper foils using a layer-by-layer peeling method, and proposed a novel strategy for evaluating residual stress levels. Our findings reveal that the rolling-induced residual stress exhibits a gradient distribution along the thickness direction. Specifically, from the surface to the central layer, the stress transitions gradually from tensile to compressive, with the stress type primarily influenced by metal flow during rolling. Additionally, we observed gradient variations in the S and Cube texture. Tensile stress favors the formation of Cube-texture, while compressive stress promotes S-texture development. Notably, Cube-texture can lead to strain localization during rolling, directly impacting the local residual stress levels and distribution. Furthermore, quantitative analysis of dislocation density using peak profile methods revealed a consistent trend between {111} plane dislocation density and lateral residual stress. Further investigation highlighted that dislocations and precipitates associated with {111} planes in face-centered cubic metals significantly influence residual stress, with their combined effects determining the overall stress magnitude in relation to texture, dislocations, and precipitates.