Abstract
The effect of Cu on the microstructure and properties of Sn-10Bi solder alloy/joint were investigated. The results showed that the microstructure of Sn-10Bi-Cu solder alloy consisted of a Sn-rich phase, Bi-rich phase, and particles of Cu6Sn5 intermetallic compounds (IMCs). The pasty range of Sn-10Bi-xCu had an influence on the spreading property of Sn-10Bi-xCu. Cu improved the growth of the IMCs layer during the liquid reaction stage. Furthermore, the hardness of the solder alloy increased as the Cu concentration of increased. The strength of the solder joint was controlled by the solder alloy hardness and the interfacial IMCs layer thickness together. For the joints with low solder alloy hardness and a thin IMCs layer, the fracture was in the solder alloy. For the joints with high solder alloy hardness and a thick IMCs layer, the fracture was in the IMCs layer.
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