Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

Abstract

The high surface area porous copper foils are synthesized on commercial copper foils by dynamic hydrogen bubble template electrodeposition method. The electrochemical deposition mechanism of porous copper foils and the current density on the structure formation mechanism are explored. The results show that under the conditions of stable electrolyte, electrodeposition time of 20 s, and current density of 2 A·cm−2, the microporous distribution of the deposited layer is uniform and the adhesion between the pore walls is strong. Compared with the planar copper foil, the porous copper foil possesses the “large on top and small on bottom” porous structure, which significantly improves the specific surface area of the copper foil, and the resistance value decreases by 43.1%. The electrochemical test results show that the performance of the porous collector is significantly better than that of the planar collector. Furthermore, the porous copper collector has a lower charge transfer impedance (150 Ω). The results of this paper provide an innovative strategy for the preparation of porous collectors and for solving the problem of lithium metal batteries.