Abstract
The Cu/W85Cu/Cu composite was fabricated by pressureless infiltration and brazing method successfully. The microstructure and physical properties of Cu/W85Cu/Cu composites were investigated. The results show the interfacial region of Cu/W85Cu/Cu composites was consisted of Cu substrate, Cu–BAgCu28 interfacial layer, BAgCu28 layer, BAgCu28-Ni interfacial layer and W85Cu composite. Moreover, the interfacial microstructures investigated by SEM shows that that the electroplated Ni on the surface of W85Cu composites can improve the fillers wettability of the W85Cu composites. Further investigation reveals that the Cu/W85Cu/Cu composites possess relative low density (13.88g/cm<sup>3</sup>), excellent thermal management function as a result of high thermal conductivity up to 288.68 W/(m•K) and low coefficient of thermal expansion (7.55×10<sup>−6</sup>K<sup>−1</sup>) at room temperature. The above properties of composites successfully meet the requirement of electronic packaging. The shear strength test analysis shows that the Cu, filler (BAg72Cu), and electroplated Ni layer and W85Cu realized metallurgically joining.
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