Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Abstract

Eutectic Sn–Ag–Cu lead-free solder has limited applications due to cost and reliability issues. Sn–Ag–Zn solder has the advantages of low melting point, good mechanical properties and reliable welding interface. However, the research system of low silver content Sn–Ag–Zn solder is incomplete. In this paper, Sn–2.0Ag–1.5Zn low silver content alloy solder is soldered to different substrates. The interfacial reaction after soldering and the microstructure and reliability under different aging treatment conditions are studied. Sn–2.0Ag–1.5Zn solder is made into solder balls by direct melting method. The solder balls are placed in a solder strength tester to be heated and welded to the substrate, and then the solder joints are placed in a heating furnace for aging treatment. The results show that the solder is soldered to the bare Cu substrate, and a dense double-layer Intermetallic Compound (IMC) structure of Cu5Zn8 and Ag3Sn is formed at the interface after aging treatment. The double-layer structure blocks each other, limiting the development of copper-tin IMCs. The solder is soldered with the Cu substrate electroplated with Ni barrier layer, and the soldering interface forms a thin layer of Ni3Sn4 metal compound. After aging for 1000 h, the thickness of Ni3Sn4 is about 1 μm, the thickness of Ni barrier layer is kept at 2–3 μm, and the barrier effect of Ni barrier layer is stable. Sn–2.0Ag–1.5Zn solder has excellent loss performance in long aging treatment. It has good heat-resistance aging treatment, good quality of solder connection, high interface reliability and less environmental pollution. The low silver content in Sn–2.0Ag–1.5Zn solder results in a significant cost reduction. Coarse IMC Ag3Sn is not easily formed. The optimized ratio of Ag and Zn in Sn–2.0Ag–1.5Zn solder improves the strength and toughness of the solder joint. The performance has been improved, and it is a very promising alloy solder.