Abstract

This article discusses the feasibility of a new microforming technique—laser dynamic forming (LDF). LDF is a new hybrid forming process, combining the advantages of laser shock peening, and metal forming, with an ultra high strain rate forming utilizing laser shock waves. Experiments are conducted on copper foils to demonstrate this forming process. After the forming process, the mechanical and microstructure of the formed work piece will be characterized. Electron backscatter diffraction will be used to investigate the grain microstructure and misorientations quantitatively. The residual stress distributions will be measured using x-ray diffraction. The key factors for the improved formability of this high strain rate microforming process will be discussed in detail. With further development, LDF may become an important microforming technology for various materials.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call