Abstract
This research has investigated the microstructural analysis and shear strength of Sn-1.0Ag-0.7Cu (SAC107) alloy used as matrix while silicon nitride (Si3N4) as reinforcement particles with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %). The composite solders were fabricated using powder metallurgy (PM) method consisting of mixing, compaction and sintering process. With additions of Si3N4 particles, the composite solders experienced a corresponding increase in strength due to fine and homogeneous microstructure. This is signified that the presence of Si3N4 particles effectively refines the microstructure.
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