Abstract
Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder alloys were mixed with 0.5, 1.5, and 2.5wt.% NiO ceramic nano-elements to produce a new set of nanocomposite solder pastes. The displacement phenomenon of NiO nanoparticles during reflow soldering process may contribute efficient idea in the field of microelectronic industries. The reinforcement of reactive nanoparticles in SAC 305 solder paste caused 50% changes in the intermetallic layer thickness and hardness of plain solder. Top-view microstructural analysis wherein dimple surfaces were magnified showed that the combination of SAC 305–2.5wt.% NiO nanopaste exceeded the limits of alloy addition.
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