Abstract

Partial transient liquid phase bonding (PTLPB) was applied to silicon nitride/nickel-based superalloy (DZ483) joints using Ti/Cu/Ni interlayers. Microstructure examination and mechanical properties evaluation of the joints show that bonding of Si3N4 to superalloy was successful. A uniform compact reaction layer about 2.7μm thickness was found at the Si3N4/Ti interface, which was formed by the reaction between Ti and Si3N4 substrate. With joining temperature rising, the flexural strength of the joining samples increased initially and then decreased. When the joining temperature was 1323K, the flexural strength of the joints reached to 170MPa. The fracture behavior of the joints was also discussed, with the ceramic reaction layer being the region where all failures occurred.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.