Microstructure and enhanced joint performance of porous Si3N4 ceramics in ultrasonic soldering

Abstract

Brazing is a commonly used method to join porous Si3N4 ceramics; it requires high temperature, long holding time, and vacuum environment. In this work, given the phenomena of sonocapillary and increased cavitation in narrow channels, ultrasonic-assisted soldering was successfully used to join porous Si3N4 ceramics at low temperature of 230 °C in the air within a short period. The effect of ultrasonic time on the microstructure and mechanical properties of the soldered joints was studied. The bonding mechanism of solder to ceramic was studied by scanning electron microscope, electron probe microanalyzer, and transmission electron microscope (TEM). Results showed that the Sn9Zn solder can infiltrate the microchannels of the porous Si3N4 ceramics through sonocapillary within a short ultrasonic time of 3 s. Prolonged ultrasonic time resulted in better wetting of solder to ceramic and wider infiltration layer. The infiltrated solder tightly bonded with the ceramic rod without pores and cracks. The TEM results showed that Zn and O were the main bonding elements. The bonding interface was characterized by nanocrystalline and amorphous ZnO. The shear tests revealed that prolonged ultrasonic time enhanced the joint strength.