Abstract
As a new type of dielectric material, the low dielectric constant and corona resistance life of fluorene polyester (FPE) restricts the range of its applications. In order to simultaneously achieve a high dielectric constant and the long corona aging lifetime of FPE, SiO2 nanoparticles were chosen as additive to prepare FPE-based composite films. The microstructure of the composite film was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), infrared spectroscopy (IR) and small-angle X-ray scattering (SAXS). The dielectric performances of the composites, including the dielectric constant, breakdown strength and corona resistance lifetime, were investigated. The results show that the introduced SiO2 does not destroy the structure of the FPE molecular chain and that it increases the thickness of the filler-matrix interface. The dielectric constant of SiO2/FPE composites increased from 3.54 to 7.30 at 1 Hz. Importantly, the corona resistance lifetime increased by about 12 times compared with the pure FPE matrix. In brief, this work shows what possibilities there might be when considering the potential applications of high-strength insulating materials.
Highlights
IntroductionLimited by the low dielectric constant of pristine polymer and the poor corona resistance life, the application of polymers in some insulation or high-k fields is, restricted [15,16,17]
The scanning electron microscopy (SEM) images of a fractured cross-section of the composite film at 9 wt% are shown in Figure 2 (Figure 2b is a magnification of Figure 2a)
SiO2 particles were dropped into an fluorene polyester (FPE) matrix using the solution blending method to improve the dielectric and insulation properties of the composite dielectric
Summary
Limited by the low dielectric constant of pristine polymer and the poor corona resistance life, the application of polymers in some insulation or high-k fields is, restricted [15,16,17]. For ferroelectric polymers, such as PVDF(Polyvinylidene fluoride) and their copolymers, despite the fact that they generally have a relatively high dielectric constant and breakdown strength, their high dielectric loss and poor thermal stability present challenges. To maintain stability under high temperature and other conditions, polymers containing strong intramolecular or intermolecular forces—bonds such as hydrogen bonds
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