Abstract
Transmission and scanning electron microscopes were used to characterize the microstructures of electroless copper deposits plated on large-grained copper sheets, amorphous Pd-Cu-Si alloy, and SnCl 2-PdCl 2 activated plastic substrates. Nucleation and growth patterns were found to depend markedly on the type of substrate. The presence of a large number of small gas bubbles containing hydrogen is characteristic of these deposits. The effect of these bubbles on film ductility is discussed and shown to cause hydrogen embrittlement in the copper films.
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