Abstract
The creep behavior of TC11 titanium alloy prepared by electron beam directed energy deposition (EB-DED) under various temperatures and stresses was investigated. The results indicated that TC11 prepared by EB-DED maintained excellent creep resistance in the temperature range from 550 °C to 600 °C, compared with the forged TC and TA series titanium alloys. The creep process accelerated with increasing temperature and stress, leading to elevated creep rates and shortened creep lifetimes. The improved creep resistance was related to the multiscale microstructures, i.e., the primary β columnar grains, the refined α lamellar microstructure and the solid solution strengthening effect of Si element predominantly existing in a nearly fully dissolved state.
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