Microstructure and corrosion resistance of vanadium films deposited at different target-substrate distance by HPPMS

Abstract

High power pulsed magnetron sputtering (HPPMS), a novel physical vapor deposition technology, was applied to prepare vanadium films on aluminum alloy substrate in this paper. The influence of target–substrate distance (D t–s) (ranging from 8 to 20 cm) on phase structure, surface morphology, deposition rate, and corrosion resistance of vanadium films was investigated. The results show that the vanadium films are textured with a preferential orientation in the (111) direction except for that fabricated at 20 cm. With D t–s increasing, the intensity of (111) diffraction peak of the films decreases and there exists a proper distance leading to the minimum surface roughness of 0.65 nm. The deposition rate decreases with D t–s increasing. All the V-coated aluminum samples possess better corrosion resistance than the control sample. The sample fabricated at D t–s of 12 cm demonstrates the best corrosion resistance with the corrosion potential increasing by 0.19 V and the corrosion current decreasing by an order of magnitude compared with that of the substrate. The samples gain further improvement in corrosion resistance after annealing, and if compared with that of annealed aluminum alloy, then the corrosion potential of the sample fabricated at 20 cm increases by 0.415 V and the corrosion current decreases by two orders of magnitude after annealed at 200 °C. If the annealing temperature further rises to 300 °C, then the corrosion resistance of samples increases less obviously than that of the control sample.