Abstract
The microstructure and corrosion behavior of electroless Ni–P alloy plating on 6061 aluminum alloys substrate in an alkaline plating bath with sodium hypophosphite as reducing agent were investigated. The effects of bath temperature on the plating rate, compositions, and microstructure of the electroless Ni–P deposits were studied. The results showed that the deposition rate and the P content of the electroless Ni–P deposits increased with the rise of the bath temperature. Scanning electron microscopy (SEM) of the deposits showed nodular structure for binary deposits. X-ray diffraction patterns of all the deposits revealed a single and broad peak which indicated the amorphous structure of the deposits. Corrosion resistance of the Ni–P coatings was evaluated by potentiodynamic polarization. The results indicated that electroless Ni–P plating could obviously improve the corrosion resistance of 6061 aluminum alloy.
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