Abstract

It is tried in this paper to study microstructural features related to erosion of infiltrated W-10wt%Cu at ultra-high temperature against liquid alumina droplets. Also the effect of post-sintering annealing on the fracture mode and erosion resistance of the composite has been examined. For this purpose, the composite material has been prepared by compressing, sintering (also vacuum annealing) and infiltration of initial tungsten powder. The erosion test carried out by static firing of the bi-propellant engine (using two types of propellant: typically a fuel and an oxidizer) and the microstructure evolutions were studied by SEM and EDS. It is found that the main erosion mechanism of infiltrated W-10wt%Cu composite, includes inter-granular fracture of tungsten skeleton and chipping. Extra sintering of skeleton takes place in outer copper-free skin of eroded composite. Also, melting and evaporation of copper occurs due to ultra-high temperature of erosion test and leads to formation of evacuated porosities. On the other hand, alumina droplets can penetrate into evacuated porosities. Also, vacuum annealing of sintered skeleton resulted into about 33% higher erosion resistance of composite. The obtained results were discussed based on weak points in infiltrated composite, transpiration cooling and microstructural evolution during erosion. This study provides an insight into correlating microstructural evolution with the erosion mechanism of infiltrated W-10wt%Cu composite.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.