Microstructural study on the effect of thermo-physical properties for plasma sprayed Ni and Ni[sbnd]20Cr splats formed on Cu substrates

Abstract

Ni and Ni20Cr powder particles were air plasma sprayed onto polished copper substrates to gain insight into the flattening behaviour of both Ni and Ni20Cr particles (splats) formed on a relatively low melting point material (i.e. copper) substrate. The extent of any interfacial bonding, along with any splat-substrate intermixing derived from the different thermo-physical properties of the sprayed particles were characterised. The plan-view features of the splats were captured using scanning electron microscopy (SEM), while splat-substrate interfacial properties were examined using focused ion beam microscopy (FIB) and transmission electron microscopy (TEM). The chemical characteristics of the splat and substrate were analyzed using energy-dispersive X-ray spectroscopy (EDS). The addition of ∼20 wt% chromium to Ni (i.e the Ni20Cr particles) was observed to significantly influence the spreading behaviour of the particles on impact with the substrate, both the extent of any splat splashing and the splat flattening ratio, as well as the microstructure of the splat-substrate interface, including the degree of substrate melting and the likelihood of material from the substrate jetting into the body of the splat. The evidence of intermixing between the splat and the copper substrate for both feedstocks is an intriguing feature of this study. The presence of a thermodynamically formed copper oxide layer during substrate preheating also influenced both the splat formation behaviour and substrate melting as observed by both microstructural examination and investigation through numerical models.