Abstract
As a heat-resistant die attach technology processed at low temperatures, three Ag filler-based sinter joining materials have been proposed. Among these, Ag flake pastes exhibited the greatest potential. Joining was carried out by sintering Ag nanoparticles/flakes in air at 200 °C for 60 min. All of the joined samples survived up to 1,000 thermal cycles in a temperature range from −40 to 180/250 °C with a 30 min dwell time. In particular, the joining strengths with the Ag micron and, Ag nano-thick flake pastes maintained excellent strength. Neither thermal fatigue cracks nor large voids were observed in the Ag sintered layers. Thus, low-temperature and low-pressure sinter joining with Ag flakes is expected to have an application in high power semiconductor devices for ultra-high temperature operation.
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