Abstract
The effect of micron-size silicon nitride (Si3N4) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si3N4(0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
