Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

Manoj Kumar Pal,Dániel Koncz Horváth,Zoltán Gácsi,Gréta Gergely

doi:10.30544/344

Manoj Kumar Pal, Dániel Koncz Horváth + Show 2 more

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https://doi.org/10.30544/344

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Abstract

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.

Highlights

Soldering is the essential joining process in the electronics industry
This paper aims to develop a comparative analysis of the mechanical properties of different lead-free solder alloys with those of the traditional Sn–Pb alloy
High Ag content solder joint has lower drop lifetime in the electronic assembly when subjected to drop impact, which is the testing results given by Amagai et al [12]

Summary

Introduction

Soldering is the essential joining process in the electronics industry. Environmental and health hazards studies of Pb-Sn solders with focus on lead-free alternatives are meet in reliability [1]. It is important to ensure that the thermal, mechanical and physical properties of lead-free solders are superior to those of Sn-Pb solders. Since the portable electronic products increased to high speed, lightweight, continual miniaturization, and multi-functionality of integrated circuits, the transition to. Pb-free solders occurred to compact with the increase in portable electronic products. In the reliability condition, both the thermal cycling loading and drop performance are essential for portable electronic products. The most important for electronic industry appears to be the Sn-Ag-Cu (SAC) alloys eutectic or near eutectic alloy system.

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