Abstract
To provide new insight into microstructural development during creep, sequential EBSD (electron backscatter diffraction) orientation maps were obtained from fixed surface areas at intervals in creep tests of a high-pressure die-cast Mg–8.5Al–1Ca–0.3Sr alloy. Samples were tested at 200 °C at various stress levels to achieve power-law creep behavior. In all specimens, steady-state creep was marked by the formation of tension twins. At intermediate stress levels, specimen failure was initiated by the formation of defects at boundaries with high crystallographic misorientation. However, at high stress levels, the failure mechanism was assisted by the crack formation at interdendritic boundaries with low crystallographic misorientation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
