Abstract
In a previous study, a lead-free solder, Sn-6Bi-2Ag-0.5Cu, was developed by mechanical alloying. The alloy shows great potential as a lead-free solder system. In the present work, the microstructural evolution during thermal shock and aging was examined. In the as-soldered joints small bismuth (1 µm to 2 µm) and Ag3Sn (1 µm) particles were finely dispersed in a nearly pure tin matrix with a small amount of η-Cu6Sn5 phase in the bulk of solder. During thermal shock and aging microstructural evolution occurred with Cu-Sn intermetallic compound (IMC) layer growth at interface, bismuth phase coarsening and Ag3Sn phase coarsening. The microstructure of the solder appeared to be stable at high temperature. The shear strength of the present solder joint is higher than that of Sn-37Pb and Sn-3.5Ag solders. Shear failure occurred Cu-Sn IMC layer-solder interface and in the bulk of solder.
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