Abstract
Nanostructured Cu-/Al-laminated composites were processed by accumulative roll-bonding (ARB) technique for four cycles. Microstructural evolutions inside the Cu and Al layers and the interfacial reactions were revealed after annealing at different temperatures. Recovery and recrystallization occurred in the Cu and Al layers at low annealing temperatures, and three kinds of intermetallic compounds formed near the interfaces. The mechanical properties of these composites after annealing were investigated by tensile tests, and the variation of strength–ductility synergy was comprehensively discussed by considering the roles of constituent and the intermetallic compounds.
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