Abstract
In this work, the interface of a CuW/Al composite with and without a nickel (Ni) interlayer during solid‐state diffusion bonding is investigated. The effects of different intermetallic compounds (IMCs) forms at the interface on the microstructure and mechanical properties are analyzed. Electroless deposition of a Ni interlayer onto the surface of CuW effectively inhibits the formation of the Al2Cu phase and the thickness of the IMCs layer is greatly decreased. Meanwhile, the type of IMCs is changed, and the indentation hardness is slightly reduced. Compared with the CuW/Al composites without Ni interlayer, the CuW/Al composites with Ni interlayer provide a desirable ≈50% increase in the shear strength, which can reach 30 MPa at 550 °C. Additionally, the interface with Ni interlayer mainly consists of Al3Ni2 and Al3Ni, and the first‐principles calculation shows that Al3Ni2 exhibits a structural stability superior to Al3Ni. Experimental and calculation results consistently indicate that Al3Ni2 forms first because of the low formation enthalpy.
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