Abstract
A new submicro-layered TiC0.61/Cu(Al) composite has been prepared by hot-pressing a mixture of 50vol.% Ti3AlC2 and 50vol.% Cu powders at 1150°C and 30MPa. It is shown that the initial reinforcement Ti3AlC2 particles have, after synthesis, an unusual microstructure, which consists of submicron-thick layers of TiC0.61 and Cu(Al) alloy. Both the width of the TiC0.61 and Cu(Al) layers are ∼150nm. Thus, the Ti3AlC2 particles are decomposed into the TiC0.61 phase, while the additional Al atoms provided by Ti3AlC2 diffuse into the molten Cu matrix at high temperature.Compression tests were performed at constant strain rate in the temperature range 20–800°C. The new designed TiC0.61/Cu(Al) composite has both a high yield stress, σ0.2 measured at 0.2% strain offset, and a high ultimate compressive strength, σUCS, which is attributed to strong interface bonding between TiC0.61 and Cu(Al) phase. For instance, at 20 and 200°C, σ0.2 is 770MPa and 700MPa, while σUCS is 1.18GPa and 1GPa, respectively. Plastic deformation takes place in the Cu(Al) matrix. Wavy slip lines are observed indicating that cross-slip could be the dominant deformation mechanism.
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