Microstructural and Thermal Characterization of Copper Based Composites for Thermal Management in Electronic Packaging

Abstract

Copper based composites with 30, 40, 50 and 60 vol.% Al2O3 were fabricated by powder metallurgy and consolidated by pulsed electric current sintering (PECS). For the purpose of determining the advantage of using coated fillers, composite alumina particles with 18 vol.% copper were prepared by electroless copper plating. Coatings were continuous and homogeneous through alumina surface. Thus, composites consolidated by the modified process increased contact between the matrix and filler, which resulted in superior thermo-physical properties. Thermal conductivities of 210-99 and 227-114 W/mK were obtained for Cu/Al2O3 made by the admixture and the coated filler method, respectively. Such superiority is mainly attributed to the continuity in the matrix phase; the thermal conductivity values observed are similar to those shown by the traditional materials used in electronic packaging. The coefficient of thermal expansion was slight lower in composites fabricated by the coated filler method; values in the ranges of 14-11 and 13-10.5 μm/m°C were obtained for the admixture and the coated filler method, respectively.