Abstract
The present work is devoted to the microstructural study of D16-AT aluminum alloy-based adhesive compound made of VK-27 adhesive with a sublayer of cured VK-25 phenol resin adhesive. The microstructure of adhesive layers is found to be heterogeneous at several scale levels. The effect of the microstructure of adhesive layers on the characteristics of their deformation and failure processes is elucidated. An exfoliation test reveals that adhesive compound fractures occur predominately at the boundary between a phenol resin sublayer and an epoxy resin adhesive layer, and the shear test induces the propagation of cracks through the epoxy resin adhesive layer.
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