Abstract
In this paper miniaturization of a microstrip patch strain sensor (MPSS) using fractal geometry was proposed and analyzed. For this purpose, the transducer of Sierpinski curve geometry was utilized and compared with the most commonly utilized rectangular resonator-based one. Both sensors were designed for the same resonant frequency value (2.725 GHz). This fact allows analysis of the influence of the patch (resonator) shape and size on the resonant frequency shift. This is very important as the sensors with the same resonator shape but designed on various operating frequencies have various resonant frequency shifts. Simulation and experimental analysis for all sensors were carried out. A good convergence between results of simulation and measurements was achieved. The obtained results proved the possibility of microstrip strain sensor dimensions reduction using Sierpinski curve fractal geometry. Additionally, an influence of microstrip line deformation for proposed sensors was studied.
Highlights
Safety assurance is very important task in case of civil structures
According to the authors’ knowledge, this is the first application of fractal geometry in microstrip strain/stress sensors
Many various fractals were created and even more reports on the use of fractal geometry in telecommunications applications were published. This is due to the fractal geometry modifications and various feed methods
Summary
Safety assurance is very important task in case of civil structures. For many years, civil constructions were evaluated using periodic inspections. Strain evaluation using the microstrip antenna sensor is based on reflection coefficient S11 measurement in the frequency domain. In this case the strain measurement cannot be performed when the exact angle of external force is unknown This is due to different resonance frequency shifts caused by different force directions—non isotropic sensitivity. The strain measurement performed by two resonant frequencies monitoring enables the examination of direction and value of stress. According to the authors’ knowledge, this is the first application of fractal geometry in microstrip strain/stress sensors It will enable sensor diminution without the use of expensive microwave laminates or may be an additional option using a high electrical permittivity laminate and fractal geometry to achieve an even bigger reduction in the deformation measurement area. Only the influence of the patch shape on sensor sensitivity was studied
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