Microscopic Study on the Mechanism of Tool Bond Wear in Cutting Ni–Fe-Cr-Co–Cu Series Nickel-Base Superalloy

Abstract

In the process of nickel-based alloy machining, chips are easy to bond on the tool surface, which weaken the tool performance and make the tool wear. Therefore, it is very important to study the mechanism of tool bond wear in the process of nickel-based superalloy machining. In order to reflect the wear process of the tool from the perspective of micro cutting, the molecular dynamics simulation model for cutting Ni–Fe-Cr-Co–Cu nickel-based alloy with SiC tool was established. The Morse potential functions between the tool and workpiece are calculated, and the simulation results are analyzed visually. It is found that the bond wear is the main wear form of tool in the process of cutting nickel-based alloy, and the wear processes are divided into three stages: contact, adhesion and shedding. The stress and strain in the cutting area are calculated and it is found that the bond occurs when the tool-workpiece extrusion is strong. Through the calculation of radial distribution function and formation energy, it is found that Ni-Si compound is formed on the tool surface, and the newly generated Ni-Si compound reduces the tool performance compared with the silicon carbide structure. This study provides a more complete microscopic explanation of the tool wear mechanism, which is helpful to find a method to prolong tool life.