Microscopic mechanism and numerical calculation of electroplastic effect on metal's flow stress

Abstract

Based on the quantum theory and dislocation thermally activated plastic flow concept, the mechanism of electroplastic effect will be studied at a microscopic level. From the perspective of energy exchange between free electrons and metallic ions, the change in free energy of dislocation can be calculated using the quantum theory. According to the thermally activated strain rate equations, the relationship between electric current and strain rate could then be obtained. Eventually a new analytical formulation for the determination of flow stress in the electroplastic forming process will be derived to address the effect of electric current on the plastic deformation of metals. The results of this paper will help establish solid theoretical foundation for the accurate prediction of electroplastic forming process of metals.