Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations

Abstract

This research focuses on developing high-fidelity experimental and numerical models to analyze microscale underfill dynamics and void formation in high-density flip-chip packaging. Three underfilling scenarios are investigated, namely, point type, I-shaped line type, and L-type line type. The point-type underfilling validates the numerical model against experimental results, while the I-shaped and L-type line-type underfilling explore grid independence, void formation, and critical parameters such as filling position, contact angle, and liquid viscosity. Results indicate that contact angle and viscosity significantly influence filling efficiency and interface evolution. A smaller contact angle accelerates the process, reducing interface jumping motions. Viscous effects are quantified, revealing dimensionless filling time convergence. The use of low-viscosity surrogate fluids enhances numerical simulation efficiency. Sub-bump-sized, bump-sized, and sup-bump-sized voids are observed, identifying three void formation scenarios representing different underfilling flow mechanisms. This study provides insight into microscale flip-chip underfill physics and establishes validated models for next-generation high-density flip-chip products. These models can be further refined and integrated into optimization tools for automated process design, contributing to improved assembly yield and reliability of emerging electronic packages through physics-based understanding and modeling.