Microscale patterning of semiconductor c-Si by selective laser-heating induced KOH etching

Abstract

Laser patterning has been used for the micro-scale fabrication of semiconductor devices like solar cells, photodetectors, LEDs, and also for modification of surfaces for wettability, reflected colors, initial bacterial adhesion, etc, due to its several advantages of patterning flexibility, spatial resolution, and mask-free operation over complex conventional lithography. Currently, laser-induced ablation is a promising patterning method in silicon solar cell fabrication; however, laser-induced defects, and thermal stresses remain a significant concern. In this paper, we demonstrate a laser ablation-free method for patterning c-Si based on the observation that the anisotropic etching of c-Si by KOH is highly temperature-dependent as the etching rate is about 100 times faster at 80 °C compared to room temperature. The laser heating-induced chemical etching (LHICE) of crystalline silicon can help alleviate such laser-induced damage by providing the necessary low temperature on the localized area(s) on the silicon substrate. We investigated the micro-second pulsed laser-assisted chemical etching of c-Si substrate for microscale patterning and showed that laser-induced damage could be eliminated as indicated by the minority carrier lifetime preservation. We also present results of the effect of laser processing parameters such as laser power, scan speed, and duty cycle on etching depth and surface morphology. The optical, surface morphology, depth profile, and LCPSim simulation results are also presented to optimize and understand the LHICE process. This versatile methodology of temperature-selective chemical etching could be applied to various thin-film and bulk materials used in diverse device fabrication.