Abstract
Although gallium-based liquid metals are attracting growing interest thanks to its potential applications in deformable, flexible electronic devices, challenges in fabrication associated with the high surface tension and oxide skin remain to be overcome. We report a novel fabrication technique for liquid metal circuits using dewetting. An excessively thin liquid film spontaneously shrinks on a substrate to reduce surface free energy. In the case of a thin liquid metal film on a substrate with microgrooves, the oxide on the microgroove wall and the additional viscous resistance delay the shrinkage in the grooves, which separates the liquid volume inside the microgrooves from the external volume. Utilizing this mechanism, we successfully produced 20- $\mu \text{m}$ -thick conductive lines of eutectic gallium indium (EGaIn) on polydimethylsiloxane. This fabrication technique is simple, fast, and cost-effective and requires no top covering layer. The resultant metal lines show potentially applicable electrical resistance to flexible and stretchable electronic devices. [2017-0082]
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
