Abstract
We demonstrate the use of laser-induced forward transfer (LIFT) in combination with a novel donor replenishment scheme to print continuous copper wires. Wires of mm length, a few microns wide and submicron in height have been printed using a 800 nm, 1 kHz repetition rate, 150 fs pulsed laser. A 120 nm thick copper donor was used along with laser pulse energy densities of 0.16-0.21 J cm−2 to print overlapping few-micron sized pads to form the millimeter long wires. The wires have a measured resistivity of 17 ± 4 times that of bulk copper.
Highlights
The ability to print continuous wires of metals, such as copper, is important for a wide variety of scientific and technological applications
We demonstrate the use of laser-induced forward transfer (LIFT) in combination with a novel donor replenishment scheme to print continuous copper wires
The results published here could lead to rapid microstructure fabrication of complex 3D structures in micro and nanotechnology as well as application to optical materials and devices
Summary
The ability to print continuous wires of metals, such as copper, is important for a wide variety of scientific and technological applications. After appropriate process optimization, only the central region of the melted donor film can be transferred, resulting in a sub-μm diameter pad, even though the melted region can be approximately one order of magnitude larger, allowing printing of features that can be ~100 times smaller in area than the spot-size of the incident laser pulse [11]. Printing of copper lines [6] has previously been demonstrated using LIFT, ( Cu was one of the very first published LIFT results), wires were LIFTed from a single composite carrier + donor + receiver sandwich structure. The printed copper wire was imaged using a Carl Zeiss SMT, Inc., Evo® scanning electron microscope (SEM)
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