Micromechanics of Deformation in Porous Liquid-Phase-Sintered Alumina under Hertzian Contact

Abstract

A series of fine-grained porous alumina samples, with and without a liquid phase, were fabricated in compositions matched closely to commercially available alumina used as microelectronic substrates. Hertzian indentation on monolithic specimens of the glass-containing samples produced a greater quasi-ductile stress–strain response compared with that observed in the pure alumina. Maximum residual indentation depths, determined from surface profilometry, correlated with the stress–strain results. Moreover, microstructural observations from bonded interface specimens revealed significantly more damage in the form of microcracking and under extreme loading, pore collapse, in the glass-containing specimens. The absence of the typical twin faulting mechanism observed for larger-grained alumina suggests that the damage mechanism for quasi-ductility in these fine-grained porous aluminas was derived from the pores acting as a stress concentrator and the grain boundary glass phase providing a weak path for short crack propagation.