Abstract
The influence of grain boundary cavitation on the overall creep response of polycrystal is investigated. The random polycrystalline microstructure is represented by means of unit cell, seeded with Voronoi tessellation. Grain boundaries are built as the planes with non zero thickness. For the grain boundary region a special material behavior is prescribed including grain boundary sliding and cavitation. Particular role of the stiffness reduction due to growing cavities in the grain boundary material during the tertiary creep stage is shown. The grain boundary cavitation, grain boundary sliding and power law creep deformation of the grain interior material are proven to be sufficient to represent phenomena observed during non-proportional loading tests in copper.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
