Micromechanical and structural properties of nickel coatings electrodeposited on two different substrates

Abstract

Fine-structured nickel coatings were electrodeposited from a sulfamate-based electrolyte onto different substrates: polycrystalline cold-rolled copper and single crystal silicon with (111) orientation. The influence of the substrate layers and chosen plating conditions on the mechanical and structural properties of these composite structures were investigated by Vickers microhardness testing for different loads. Above a certain critical penetration depth, the measured hardness value was not the hardness of the electrodeposited film, but the so-called 'composite hardness', because the substrate also participated in the plastic deformations during the indentation process. Two composite hardness models (Chicot-Lesage and Korsunsky), constructed on different principles, were chosen and applied to the experimental data in order to distinguish film and substrate hardness. The microhardness values of the electrodeposited nickel layers were mainly influenced by the current density. Increasing the current density led to a decrease in grain size, which resulted in higher values of the microhardness.