Abstract
ABSTRACT The increasing complexity of microelectronics/ engineering devices and the requirement for higher yields and automated production systems place stringent demands on the assembly techniques and performance requirements of materials, machining and joining techniques. This has led to increasing interest in the use of low power lasers for machining, welding, soldering and marking of small assemblies. Of partic ular interest to micro-component industries is the ability of such lasers to apply controlled amounts of energy in precise areas, utilizing extremely low heat input, resulting in very low distortion, and coupled with the ability to operate at high production rates in a flexible manner. The majority of these applications comprise thin materials, less than 1mm thickness. This paper describes some of the cutting, joining, drilling and marking results achieved with a high beam quality low power pulsed Nd: YAG laser. Keywords: Cutting, welding, drilling, marking, Nd: YAG laser, stainless steel, carbon composites, silicon wafers, plastics.
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