Abstract
Deep reactive ion etch (DRIE) processes are performed on both sides of a silicon-on-insulator (SOI) wafer to realize piezoelectric accelerometers consisting of 20- μm-thick epitaxial silicon cantilevers with bulk silicon masses at the tip. Sol-gel deposition of lead-zirconate-titanate (PZT) is used to realize an 800-nm-thick film on the top surface of the beams. Prior to accelerometer characterization, a system identification procedure based on laser Doppler vibrometry is performed, providing a complete description of the devices and predicted sensitivities. Frequency response measurements confirm device sensitivities in the 3.4-50 pC/g range in the flat-band (depending on device geometry), and resonance frequencies in the 60-Hz-1.5-kHz range. The self-noise for the longest beam of 8.5 mm is measured as 1.7 μg/√{Hz} at 30 Hz and is limited by dielectric loss of the PZT film which is estimated to have a tanδ of 0.02. Scaling relationships for this particular device geometry are presented to provide insight into possible future design directions.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.