Abstract
Recent progress in portable semiconductor and thermocatalytic gas sensors requires the development of the microhotplates with reduced power consumption, increased shock resistance, and low resistance drift. Rh is known as alloying component, which allows one to decrease the diffusion mobility of Pt in bulk resistive heating elements. Here, a comparison study on the stability of microhotplates based on Pt and Pt-Rh thin films is performed. The porous anodic alumina is used as a substrate, which provides high adhesion of the metal film and the thermal expansion coefficient compatible with Pt and Pt-Rh alloys. Morphology and crystal structure of metal films are studied after recrystallization annealing in air at the temperatures 600–810 °C. To simulate thermal effects of the microhotplates, a model based on the finite element method is developed. The perspectives of Pt-11 % Rh alloy as a material for microhotplates operating at the temperatures above 500 °C are discussed. The achieved characteristics of the fabricated Pt-Rh microhotplates on porous anodic alumina substrates allow one to use them as a universal platform for semiconductor and thermocatalytic gas sensors manufacturing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
