Abstract

Abstract The aim of this work was to investigate the effects of current density, temperature, pH and concentration of ethylhexilsulfonate additive on the microhardness of electrochemically deposited gold decorative coatings obtained from a conventional cyanide electrolyte and gold complex based on mercaptotriazole. Mechanically and chemically prepared brass samples were first nickeled from acidic electrolyte. Nickel was a substrate deposit, and then decorative gold coatings were deposited from two types of electrolytes at different current densities and temperatures. Decorative gold coatings were deposited from auri-mercaptotrizole at different pH values and from electrolyte with and without the ethylhexilsulfonate additive. The microhardness of the gold coating was measured using the Knoop method. The highest values of microhardness were obtained at a current density of 1 A dm−2 at room temperature for both electrolytes. The microhardness of the gold coatings from cyanide electrolytes was HK = 740 MPa, and the coatings obtained from auri-mercaptotriazole HK = 660 MPa. This difference is not relevant for decorative purposes. The highest values of microhardness, HK = 660 MPa, were obtained at pH = 9 from the gold complex based on mercaptotriazole without the additive.

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