Abstract

Recent progress in the miniaturization of electronic items introduces manufacturing challenges for achieving both better surface integrity and high throughput. Controlled thermal interaction processes physically vaporize the material for producing the miniature components but the poor surface and sub-surface characteristics introduce a niche for thermo-mechanical processes, particularly microgrinding. Prior microgrinding attempts have focussed on axi-symmetrical components of hard-brittle materials. For non-axi-symmetrical, high-aspect ratio miniature components, edge chipping was encountered. This paper reports a new grinding method that uses “high table reversal speeds” for reducing the “grit cut load” and hence facilitates the microgrinding process. An arrangement that functions on the principles of four bar linkage with a sliding and rotating pair was devised. This arrangement was designed to reciprocate between 300–1000 strokes/min for a stroke length of 10–70 mm. As a result the table feed rate range was increased from the conventional 300–20 000 mm/min to 5000–55 000 mm/min. Process characterization of the new grinding method was observed for hard-brittle materials. A physical model was developed which links the process parameters with appropriate boundary conditions and the model was verified experimentally. The experimental model was used to explain the mechanism of grinding while employing high table reversal speeds. Process characterization includes grinding force, grinding-ratio, grinding wheel topography, surface finish and SEM study. Also, the process was applied to produce mold-insert which in turn was used for molding the micro-mechanical cantilever sensor parts. Deep slots of size: 1.2×0.1×1.5 mm with an aspect ratio of 15 was successfully produced with this method. The new grinding device and method promote microgrinding through integration to an existing grinder and therefore reduces the additional cost on the capital resources.

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