Microfracture of metals during high-temperature creep

Abstract

1. A change from creep at moderate temperatures to high-temperature creep is accompanied by equalization of the defect density Δρ/ρ in the volume and in surface layers of polycrystalline metals resulting from microdiscontinuities. In this case Δρ/ρ varies with the applied stress, while the character of accumulation of defects in the process of creep changes. 2. The characteristics of high-temperature creep of polycrystalline materials are evidently due to a considerable extent to the activation of healing of microcracks in presurface layers at elevated temperatures.