Microfabrication of air core power inductors with metal-encapsulated polymer vias

Abstract

This paper reports three-dimensional (3-D) microfabricated toroidal inductors intended for power electronics applications. A key fabrication advance is the exploitation of thick metal encapsulation of polymer pillars to form a vertical via interconnections. The radial conductors of the toroidal inductor are formed by conventional plating-through-mold techniques, while the vertical windings (up to 650 µm in height) are formed by polymer cores with metal plated on their external surfaces. This encapsulated polymer approach not only significantly reduces the required plating time but also exploits the relative ease of fabricating high-aspect-ratio SU-8 pillars. To form the top radial conductors, non-photopatternable SU-8 is introduced as a thick sacrificial layer. Two toroidal inductor geometries were fabricated and tested. The first inductor had an inner diameter of 2 mm, an outer diameter of 6 mm, 25 turns and a vertical via height of 650 µm. The second inductor had an inner diameter of 4 mm, an outer diameter of 8 mm, 50 turns and a vertical via height of 650 µm. Both inductor geometries were successfully fabricated and characterized in the frequency range of 0.1−100 MHz. Characterization results of the 25- and 50-turn inductors showed an average inductance of 76 and 200 nH, a low frequency (0.1 MHz) resistance of 0.2 and 1 Ω and a quality factor of 35 and 24 at 100 MHz, respectively. Finite-element simulations of the inductors were performed and agreed with the measured results to within 8%. The turn-to-turn breakdown voltage was measured to be in excess of 800 V and currents as high as 0.5 A could be successfully carried by the inductor windings.