Abstract

We have developed novel μ-CE chips with “on chip” optical slit which cut off the stray light in order to improve the sensitivity of the optical absorption detection on μ-CE chips. Our chips which have an optical slit at the bonding interface have been successfully fabricated on synthesized quartz glass substrates using HF (hydrofluoric acid solution) bonding method [1],[2]. The signal level of UV absorption detection was improved about ten times by applying the “on chip” optical slit compared with that of conventional µ-CE chips.

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