Abstract
A series of small peel specimens made from a toughened epoxy adhesive and aluminium adherends have been used for measuring the peel force as a function of adherend thickness. These results have been used in conjunction with a recent analytical model in order to determine the fracture energy, and show how it changes as a result of different crack paths within the adhesive. In-situ SEM microextensometry has also been used to determine the in-plane displacements and strain during peeling, and to monitor the propagation of the crack path as a function of adherend thickness. It is proposed that at least one of the mechanisms responsible for the measured changes in fracture energy, over and above any contribution due to adherend plastic dissipation losses, is the influence of the carrier cloth on the stress distribution within the adhesive bond. It is believed that the carrier cloth creates a stress concentration within the adhesive, creates a load shadowing influence at the adhesive/adherend interface, and thereby precipitates cracking away from the interface and in the adhesive.
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