Abstract
Abstract In order to do the failure analysis on flip chip connected with ceramic substrate, solder bump should be completely removed from chip surface. The die soldered on ceramic substrate of flip chip package is likely damaged during the removing process for the high etching and abrasion resistance of ceramic substrate as well as the poor uniformity of mechanical polish. In this paper, a thermal method for the decapsulation of flip chip package is developed, which included heat sink removal, ceramic substrate and solder bump separation, and solder residue clean out from the chip surface. In the last step, three temperature levels of H2N2O6 – H2O (fuming Nitric acid) were selected for the removal of eutectic, high-lead and lead free solders, respectively.
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