Abstract
By growing CeO2 buffer layers on deliberately miscut Al2O3 (11̄02) surfaces, we have successfully fabricated stoichiometric YBa2Cu3O7-δ (YBCO) thick films by pulsed laser deposition. Atomic force microscopy and scanning electron microscopy observations demonstrated that YBCO films with thickness up to t ∼ 1.0 µm were microcrack-free. Characterization of the films revealed a porous morphology, consisting of interconnected islands and deep holes (pores). This feature is considered as one of the sources contributing to the strain-relieving mechanism responsible for the increase in film thickness without microcracking. Microcrack-free thick YBCO films revealed Tc = 90.5 ± 0.5 K, Jc(77.3 K, 0 T ) = 2.0-3.0 × 106 A/cm2, and a substantial enhancement of Jc × t (77.3 K, 0 T ) up to 246 A/cm.
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