Abstract
The addition of low levels of various elements can enhance the strength of high-purity aluminum with minimal effects on resistivity. The base aluminum is 99.9998% pure with a residual resistivity ratio (RRR = ρ273K/ρ42K) of 10,500 and the microalloy levels range from 2 atomic ppm up to 170 atomic ppm (5–90 weight ppm). Solute elements (B, Ca, Ce, Ga, or Y) are added to the base in binary form. The lowest RRR value obtained is 2,500. The effects of solute concentration, solute element type, and heat treatment on grain size, resistivity, and flow stress are presented. Optical micrographs also show the presence of particles that occur as a result of microsegregation during solidification.
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